A process analysis instrument for surface-profile mapping through development and small-volume production. CCD locates the wafer frame, thickness is derived from the frequency measured at each point, and the result comes out as an Excel report, a colour map and a 3D surface.
More below — specs & details
Square wafers up to 100 mm diagonal as well.
Point-by-point measurement mapped to thickness.
Re-measured with the wafer flipped: 0.003 μm on average and RMS, 0.01 μm PV.
PV, RMS, AVG, SizeX/Y reported directly.
Floor 2, Building C, Space Big Data Park, No. 20 Kangyuan Road, Xuanwu District, Nanjing, China
Mon–Sat, 8:30–17:00 (GMT+8)
